The global Flip Chip market was valued at US$ 12440 million in 2022 and is projected to reach US$ 19100 million by 2029, at a CAGR of 6.3% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

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Flip Chip is a semiconductor packaging technology that involves directly mounting a microchip or a die onto a substrate or a printed circuit board (PCB) without the use of wires or leads.

In this process, the face of the chip is flipped over so that its active side faces down, and the connections are made through small bumps, or solder balls, that are placed on the chip’s contact pads. The bumps are then aligned and bonded to matching pads on the substrate or PCB, forming a direct electrical connection between the chip and the board.

Flip Chip technology offers advantages over traditional wire-bonding packaging methods, including higher connection density, faster data transfer, and improved thermal performance. It is widely used in a variety of electronic devices, such as microprocessors, memory chips, and sensors.

Total Market by Segment:
Global Flip Chip Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (M Units)
Global Flip Chip Market Segment Percentages, by Type, 2022 (%)

FC BGA
FC PGA
FC LGA
FC CSP
Others
Global Flip Chip Market, by Product Type, 2018-2023, 2024-2029 ($ Millions) & (M Units)
Global Flip Chip Market Segment Percentages, by Product Type, 2022 (%)

Memory chips
Microprocessors
Power electronics
RF devices
Sensors
Optoelectronics
Global Flip Chip Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (M Units)
Global Flip Chip Market Segment Percentages, by Application, 2022 (%)

Auto and Transportation
Consumer Electronics
Communication
Others

Further, the report presents profiles of competitors in the market, key players include:

Amkor
Taiwan Semiconductor Manufacturing
ASE Group
Intel Corporation
JCET Group Co.,Ltd
Samsung Group
SPIL
Powertech Technology
Tongfu Microelectronics Co., Ltd
HC Semitek
SANAN OPTOELECTRONICS CO.,LTD
Focus Lightings Tech CO.,LTD.
Tianshui Huatian Technology Co., Ltd
United Microelectronics Corporation (UMC)
Intel Corporation
STATS ChipPAC Pte. Ltd.

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