Figure 2 Three-step process The electroless plating process is a chemical reduction process, which relies on the reduction effect of the contact reaction of metal ions in the aqueous solution and the metal precipitation using non-electric energy. BASF has produced a glass reinforced fiber material PA6/6T. Laser direct structuring (LDS) technology plays an important role in the production of molded interconnect devices.

Figure 3 Laser-activated surface application laser direct structuring (LDS) technology can not only improve performance, but also improve resolution, thereby increasing the integration of circuits, especially in high-frequency applications: such as antenna design. 'Except for the data, you don't need to change anything Universal Screw Terminal Blocks else, so the time required to change the design of this process is quite short. The exposed metal atoms provide a seed layer for the third step, the next electroless plating process, which will grow a copper layer with a thickness of 5-10 microns in the laser-activated area.

The laser activation process is completed by a diode-pumped IR laser generator, which generates a pulse cycle with a wavelength of 1064nm and a working frequency of 1kHz-100kHz, and its minimum propagation diameter is 40 microns. Figure 4 Molded interconnect device (MID) laser direct structuring (LDS) grade materials are available from different suppliers. This means that electronic engineers and mechanical designers need to be simultaneously exposed to laser direct structuring (LDS) technology and molded interconnect device product design.

The former is almost impossible for short-term prenatal samples. The latter's commonly used production technology for molded interconnect devices uses already carved metal sheets, which are poured into a plastic shell.Molded interconnected devices allow designers to apply multi-point connection technology to create more three-dimensional connections, but the two-shot molding process used to produce devices is quite complicated, and once a molded interconnected device is formed, it cannot be added or removed.

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