The electronic adhesives are used in printing circuit boards, which are then used in many applications such as automotive, medical devices, cell phones, computer storage, and aerospace among others. The growing demand from the developing region across the globe are the major factors driving the global market for electronic adhesive.
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The growing government investments in the development of electronic sector coupled with the augmenting investment in the retail sector are other factors contributing to the growth of the market. Among the various application, printing circuit boards are the dominant segment and are expected to show the same trend during the forecast years. The growing demand for printing circuit boards from applications such as wire tracking, chip bonding, and potting among others is contributing substantially to the growth of the segment.
Some of the prominent players operating in the Global Electronic Adhesive Market are 3M Company (U.S.), Alent PLC (U.K), BASF SE (Germany), H.B. Fuller Company (U.S.), Henkel AG & Co. KGaA (Germany), Indium Corporation (U.S.), LG Chemical Limited (South Korea), Mitsui Chemicals (Japan), Hitachi Chemicals Company Limited (Japan), The Dow Chemicals Company (U.S.), and Kyocera Chemical Corporation (Japan) among others.
The global Electronic Adhesive Market is segmented into form, type, and application. On the basis of the form, the market is segmented into liquid electronic adhesive, solid electronic adhesive and paste electronic adhesive. On the basis of the type, the global Electronic Adhesive Market is segregated into electrically conducive, thermally conducive, UV curing, and others. On the basis of the application, the market is further bifurcated into printed circuit boards, semiconductor and the integrated circuit, and others.
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The electronic conducive type segment is the leading type in the market and is expected to show the same trend during the forecast years. The electronic conductive adhesives also are known as ECA are used as efficient substitutes for traditional lead solders. The advantages such as high electrical conductivity, they have widely used microelectronic industry for packaging.
The global Electronic Adhesive Market is spanned across five key regions: Latin America, Europe , North America, Asia Pacific and the Middle East & Africa. Among these, Asia Pacific holds a major portion of the market and is anticipated show a considerable CAGR during the assessed period. The developing end-user industries in the region such as electrical and automotive are expected to fuel the market growth. Moreover, the favorable government policies such as tax benefit and incentives among others has resulted in the shifting of the manufacturing base in the developing regions of Asia Pacific The key counties attributing to this growth are India, China, and Japan. North America is the dominant region for the electronic market adhesive. The developed end-user industries coupled with the growing adoption of electronic adhesive are the major factor contributing to the growth of the market. The major countries attributing to this growth are Canada, and U.S. European market of electronic adhesive is expected to show steady growth during the forecast years. Industry. Moreover, the increasing use of electronic adhesives in the automobile industry is driving the market in this region.
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