The global automated optical inspection system market size is estimated to be USD 646 million in 2021 and projected to reach USD 1,660 million by 2026, at a CAGR of 20.8%.

The emergence of smart technology as well as utilization of AOI system in newer applications is alsoexpected to drive the growth of the market in the near future.

Today’s world is incredibly fast-paced, demanding that people and technology move quickly as well. As the years’ pass, we expect things to get even faster, and this includes electronics. To allow the devices to keep up with this growing demand for speed, PCB technology will need to adapt accordingly. High-speed PCBs are a unique subject for designers as it increases the complexity while designing. A high-speed PCB is one where the integrity of the signal is affected by the circuit layout. PCBs are the essential building block for nearly everything electronic.

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The introduction of nanotechnology has triggered the miniaturization and use of high-density PCBs in electronics manufacturing. However, with these advancements, many problems are arising. As the size of the PCB is shrinking, the ball grid array (BGA) gap is also decreasing, which gives rise to various defects in the PCB. Few of these defects include substrate corrosion, material mismatch, solder paste defects, and susceptibility to EMI interference. These defects cannot be precisely identified using manual inspection. Hence, there is a rising demand for the use of AOI systems in the detection of IC substrate defects.

An AOI system works efficiently while inspecting PCBs where solder joints are visible. However, with the advent of new PCB and IC manufacturing technology such as ball grid array (BGA), where solder joints are not visible, AOI systems are not capable of finding soldering defects. On the other hand, other inspection technology, such as automated x-ray inspection (AXI), can inspect a wide range of assembly defects of PCBs with BGA technology. AXI uses X-rays instead of light imaging to inspect the PCBs. Companies often use AXI to evaluate particularly complex or densely constructed boards.