The "Radiation Hardened Electronics Market" research predicts significant growth, with a noteworthy compound yearly growth rate (CAGR) of 4.0% over the projected period, from USD 1.5 billion in 2022 to USD 1.8 billion by 2027.

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A number of reasons, including the increased demand for parts like Mixed Signal ICs, Processors & Controllers, Memory, and Power Management, will contribute to the market's growth. The industry is also anticipated to grow as a result of improvements in manufacturing processes like RHBD (Radiation Hardened by Design) and RHBP (Radiation Hardened by Process). In the upcoming years, this market is expected to experience rapid expansion as applications for radiation-hardened electronics continue to grow in a variety of industries.

The radiation-hardened electronics market is expanding significantly as a result of ongoing technological developments in multicore processors created especially for military and space applications. The market is also growing as a result of the expanding prevalence of worldwide intelligence, surveillance, and reconnaissance (ISR) activities as well as the rising demand for electronic devices that can resist harsh nuclear environments. The radiation-hardened electronics market is expected to have significant growth and adoption in the near future as these specialised electronics become more important in crucial industries.

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Power electronics component to hold the largest size of radiation hardened electronics market during the forecast period

During the anticipated period, the market for radiation-hardened electronics is expected to be dominated by the power electronics component. Due to its exceptional resistance to high-energy charged particles and ionising radiation, MOSFET power electronics are increasingly being used in space and high reliability applications, which is primarily responsible for this rise. Companies like IR HiRel (US), a division of Infineon Technologies AG (US), which offers Si MOSFET devices to improve system efficiency and lower costs per bit in high-throughput satellites, are good examples of how manufacturers are actively working to improve the performance of MOSFET devices for space applications. The R9 MOSFET also offers a broad selection of gate drivers and enhanced current capabilities to satellite designers, thus enhancing the power electronics component's importance in the radiation-resistant electronics industry.

COTS in product type segment is expected to grow at the fastest CAGR during the forecast period

The radiation-hardened electronics market is anticipated to grow at the fastest rate in the COTS (Commercial Off-The-Shelf) segment. Because low-cost nanosatellites are being developed at an accelerated rate and offer new potential for COTS adoption, COTS, which already holds a sizable market share, is growing quickly. Additionally, COTS are favoured for military space missions due to their appealing signal processing designs. A desirable way to cut costs in space applications is to swap out COTS components for ceramic packages that are pin-out compliant and have the same functionality as the original devices. The rapid growth of COTS in the radiation-hardened electronics sector is a result of this cost-saving strategy, which not only minimises risk but also shortens development time.

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North America expected to dominate the radiation hardened market during the forecast period

Throughout the projection period, North America is anticipated to continue to dominate the market for radiation-hardened electronics. The rising demand for radiation-hardened components in both commercial and military satellite applications is responsible for the region's leadership position. Reliable radiation-hardened microelectronics are required by the US Department of Defence (DoD) and other private companies to support mission-critical initiatives like satellites and nuclear modernisation activities. The US government has made steps to improve domestic production capabilities for radiation-hardened microelectronic components, such as authorising the use of Title III of the Defence Production Act (DPA) beginning in December 2021. These initiatives highlight North America's ongoing dominance and expansion in the market for radiation-hardened electronics.

Key players in the radiation hardened electronics market are Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Xilinx, Inc. (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor (US).

News Covered:

https://www.globenewswire.com/en/news-release/2023/01/31/2598365/0/en/Global-Radiation-Hardened-Electronics-Industry-Size-is-Anticipated-to-Gain-1-8-Bn-by-2027-at-a-CAGR-of-4-0.html

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