Overview:

The global 5G chipset market share is set to cross USD 9.22 billion, with a 41.2% CAGR during the forecast period of 2018 to 2023. Market Research Future (MRFR) marks growing automation, use of IoT, expansion in data center network, hike in bandwidth, advanced antenna technology, participation from mobile operators, machine to machine communication, and others as the major traction providers.

Segmentation:

The global 5G chipset market, as discussed by MRFR analysts, has been studied on the basis of a segmentation that includes the product, operational frequency, type, and verticals.

By type, the market includes radio frequency integrated circuit (RFIC), cellular integrated circuit, application-specific integrated circuit (ASIC), and millimeter-wave integrated circuit.

By operational frequency, the market comprises 26–39 GHz, below 6 GHz, and 39 and above GHz.

By product, the market encompasses customer premise equipment and network infrastructure equipment.

By vertical, the market discusses IT & telecommunication, retail, government, automotive & transportation, healthcare, industrial, energy & utilities, and others.

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Regional Analysis:

Structural benefit, investment scope, and the presence of major players are expected to put North America and Europe in advantageous positions. Asia Pacific would also gain from the booming electronics industry and growing incorporation of automation and IoT.

Competitive Landscape:

The global market for 5G chipset is set to profit from the strategic moves of companies like Intel Corporation (US), Nokia Oyj (Finland), Qualcomm Inc (US), Xilinx Inc (US), IBM Corporation (US), Samsung Electronics Co Ltd (South Korea), Integrated Device Technology Inc (US), Qorvo Inc (US), Infineon Technologies AG (Germany), Broadcom Inc (US), Anokiwave (US), Analog Devices Inc (US), MACOM Technology Solutions Holdings Inc (US), Huawei Technologies Co., Ltd (China), Telefonaktiebolaget LM Ericsson Class B (Sweden), Cavium Inc (US), KT Corp (South Korea), ZTE Corporation (China), Hewlett Packard Enterprise Co (US), Fujitsu Ltd (Japan), and others.

Industry News:

In September 2020, Samsung inked a deal with Qualcomm to produce the latter’s next-generation 5G mobile chipsets using the latest technology of the 5nm process. The deal has a valuation of around $844 million and will be the first time when Samsung will be producing chips for Qualcomm. The first one of this series will be Snapdragon 875. At present, Samsung produces 8nm devices for Qualcomm. But this deal ensures an advantageous position for Samsung from where it can take forward its TSMC technology. Samsung is also in talks with Intel to produce chips for the latter’s fabrication process.

In September 2020, MediaTek declared that its 5G smartphone chip, the Dimensity 1000C, had hit the market in the United States. The Dimensity 1000C is expected to power LG’s newest device, the LG VELVET, on T-Mobile’s nationwide 5G network. It will deliver advanced AI capabilities, better display features, fast connectivity, and enhanced multimedia capabilities that would improve the user experience. The 7nm Dimensity 1000C is known for its super-fast 5G speeds and it helps in expanding the MediaTek’s 5G family of chipsets. The flagship series is also known to deliver full premium 5G experiences for smartphone users.

During the CIVID-19 crisis, a lot of industries got hit by the impact of the pandemic, but the telecommunication industry stayed abreast and it found a way out by incorporating latest technologies and creating scope for further integration. It is slated to benefit more from the changing work cultures and business dynamics, which would inspire the expansion of the 5G chipset industry.

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