PRESS RELEASE: https://www.coherentmarketinsights.com/press-release/3d-ics-market-3211

Market Trends

1. Multi-chip packaging is a major trend. In multi-chip packaging, a large number of transistors are packed into a single 3D integrated circuit. This approach enables better interaction among the processor and memory; hence, this type of packaging is essential for memory enhanced applications.

2. Int-Sim is another major trend. This open-source tool can be used for forecasting 2D or 3D chip power, a
number of metal levels, die size, and best possible sizes of metal levels depending on several design parameters and technology


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Key Market Opportunities:


Advent of big data analytics can present lucrative growth opportunities. As storage,
processing, and transfer of the external data from Social media are the key challenges faced by these
companies.

Collaborations among market players can provide business opportunities. For instance, In May 2013, STATS ChipPAC Ltd. collaborated with Qualcomm Technologies Inc. and A*STAR Institute of Microelectronics to deliver technology building blocks for low lost interposers used in 2.5D/3D ICs.


Impact of COVID-19 on 3D ICS Market:

Due to less production of 3D ICs, there is shortage of 3D ICs in the market . For instance, in May 2020, OPPO Company has shut down its operations in Noida as six employees test coronavirus positive.



Key players operating in the market are:

Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation.


Geographies Covered:

North America: U.S., Canada
Latin America: Brazil, Argentina, Mexico, Rest of Latin America
Europe: Germany, U.K., Spain, France, Italy, Russia, Rest of Europe
Asia Pacific: China, India, Japan, Australia, South Korea, ASEAN, Rest of Asia Pacific
Middle East: GCC Countries, Israel, Rest of Middle East
Africa: South Africa, North Africa, Central Africa


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Market Segmentation:

By End-Use Sectors: Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others(Biomedical applications and R&D).

By Substrate Type: Silicon on insulator(SOI), Bulk silicon.

By Fabrication Process: Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization.

By Product: MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED.