Wafer inspection equipment is fabrication system utilized for the detection of defects during the semiconductor wafer manufacturing processes. Increasing application of electronic semiconductor ICs in consumer electronics, industrial, automobile segments and related R&D activities is expected to drive the increased demands for the production. Requirement to maintain the quality of products and the client satisfaction is expected to remain the primary factor that would fuel the wafer inspection equipment market growth.
Advanced wireless networking technologies such as 3G, 4G, Bluetooth, ZigBee, and wireless LAN have enabled fast and easy data transmission. Smartphones, tablets, wearables and sensors integrating these technologies have witnessed significant demand increase over the past few years. In conjunction with the demands for high level integration and development of new designs to provide support to multiple application on single platforms, intensive industry competition has led to increased demands for better quality and least defects in the semiconductor devices. Moreover, increasing demands for high performance chips for mission critical applications in industries and R&D activities will present considerable growth opportunities for the wafer inspection equipment market through the forecast period.
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Optical and E-beam are complementary technologies that perform distinct operations in the workflow. optical has fast throughputs and finds great applications in the end use. On the other hand E-beam helps in detection of smallest defects, however the throughputs are low. Owing to these features, it finds substantial applications in R&D activities. Increasing demands for advanced computing and processing has led to development of 3D finFETs, NAND and advanced DRAMs, which requires the tools to assess complex structures. Wafer assessment on the scales below 10 nm is extremely difficult, and in case of overlooking of the smallest error can impact the end use. This is expected to be major industry growth challenge over the next coming years.
Wafer Inspection Equipment Market Taxonomy
On the basis of technology, the global wafer inspection equipment market is classified into:
On the basis of wafer type, the global wafer inspection equipment market is classified into:
On the basis of end user, the global wafer inspection equipment market is classified into:
Integrated device manufacturers
On the basis of regions, the global wafer inspection equipment market is classified into:
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Key players in the wafer inspection equipment market include Applied Materials, Zeiss Global, Hermes Microvision (ASML), FEI (Thermo Fisher Scientific), KLA-Tencor, Hitachi High-Technologies, JEOL, Lasec Corporation, Lam Research, Nikon, Nanometrics, Planar Corporation, Tokyo Seimitsu, Rudolph Technologies, and Toray Engineering
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