The liquid thermal interface materials market is highly fragmented, with a significant presence of unorganized players. In addition to unorganized players, the regional players also account for a significant market share.

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Liquid thermal interface materials are finding increasing utilization in consumer electronics, communication devices, and computers as the demand for high-power and high-performance circuitry in devices such as smartphones, tablets, and laptops continues to rise. Consequently, systems such as flip-chip BGA form factor packages have been developed to cater to the growing demands for high-performance and high-functioning microprocessors and ASICs. Liquid thermal interface material is gradually being integrated into microprocessors for providing the medium for efficient dissipation of heat produced while processing and functioning. Additionally, liquid thermal interface materials comply with the mechanical and size constraints in compact electronic systems which is further driving their adoption in the industry.

Liquid metals are gradually gaining traction in thermal management systems owing to their prolific heat extraction and conducting capabilities which offer higher efficiency than conventional coolants in use. With liquid metals offering better thermal management capabilities, numerous researches are working towards developing new thermal interfaces which leverage liquid metal capabilities to improve the system’s thermal conductivity. For instance, recent research which tested silver-filled thermal adhesives concluded the liquid metal thermal interface offers a reliable heat dissipation solution for high-performance electronics owing to its low thermal resistance and high conduction properties.

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Additionally, researchers studying the development of nano-liquid metals are likely to open new avenues for liquid thermal interface material manufacturers with the substance offering bright prospects for enhancing the thermal performance of existing thermal interface materials. Nano-liquid metals can potentially be incorporated into the existing thermal management systems to provide improved thermal pathways for heat dissipation. Study of using gallium-based liquid metals in thermal management is further expected to aid in liquid thermal interface materials market growth with the substance providing the required thermal conductivity in addition to it having lower melting point and viscosity. In addition to this, gallium-based liquid metals have low melting points, are flexible and reformable owing to which the material is increasingly being used in bio-devices, flexible circuits, and self-healing superconductors.

Liquid cooling systems or immersion cooling systems are gradually replacing thermal interface materials in an array of industries. While the liquid cooling system was traditionally used in data centers, innovations in the system are allowing the use of the system in electronic and automotive applications. The thermal management system offers an assortment of benefits such as temperature uniformity, better heat transfer, improved energy density in batteries, and fire suppression making it a lucrative technology for the automotive industry. Further, the system is being integrated into high-performance smartphones to prevent them from heating.

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The technology is also being used as a cooling mechanism in computers and laptops. Growing awareness about the benefits of the system in the automotive and electronics industry presents lucrative opportunities for thermal interface manufacturers who are slowly foraying into the production of liquid cooling systems to capitalize on the growing demand. For instance, 3M, a leader in the liquid thermal interface materials market recently showcased a unique computer which uses a liquid cooling system.

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