This tool is designed to calculate the junction temperature level of an electronic device (normally power devices) given four parameters: the maximum ambient temperature level, the device's junction-to-package thermal resistance, the thermal resistance of the warm sink, and the power used. It can also calculate the optimal power that the tool can manage provided its junction temperature, the optimum ambient temperature, the junction-to-package thermal resistance, and also the heat sink's thermal resistance.

The greatest operating temperature that a semiconductor in a digital device can endure is called its junction temperature level. This temperature level is commonly higher than the temperature of the tool's exterior as well as its case. The warm moved from the joint to the situation, multiplied by the junction-case thermal resistance, is equal to the difference in between the junction temperature level as well as the outside, plus, situation temperature level.

The maximum joint temperature level of a gadget is always discovered on its datasheet. It can be really beneficial when there is a demand to calculate for the required case-ambient thermal resistance, given the amount of dissipated power. The value of the optimum joint temperature level is after that made use of for picking the best heat sink.

Microprocessors commonly determine the temperature of its core through a sensor. When the core reaches its maximum junction temperature, a cooling mechanism is caused. Likewise, if the temperature level surpasses the optimum joint temperature, an alarm will be set off that warns the computer system operator to stop the process that is triggering the getting too hot of the CPU's core.
Custom Heat Sinks